1.High precision epoxy die bonder with multi-die capability.
2.Support various chip input and output media, including up to 8-inch wafer frame, tray and gel-pak.
3.Equipped with linear motor driven bond head X/Z table, pick and place force control with voice coil motor, missing units detection and auto-repick capability.
4.Equipped with high accuracy rotary stage for 2nd die xy and angle position fine alignment and adjustment.
5.Equipped with pick arm to flip die 180° and then face down bond die to substrate.
6.Standard epoxy optics for real time alignment and inspection, Individually programmable x-y-z positions for each pad, User programmable epoxy write pattern and flexible writing path control.
7.Support SECS II communication, wafermap, SEMI E142 substratemap and die traceability .