1.Integrating with chip probe test and sorting process.
2.Support various chip input and output media, including wafer frame, tray and gel-pak.
3.Equipped with build-in force sensor to read probe touch down force, force abnormal detection and alarm capability.
4.Equipped with 4 independent test chuck, chuck stage is driven by high speed DDR motor, chip place/test/pick process in parallel to increase throughout .
5.Equipped with 2 independent high speed Linear motor driven X/Y/Z pick&place bondhead table, soft touch and slow up functionality, missing units detection and auto-repick capability.
6.Equipped with uplook optics to enhance chip probe test position accuracy.
7.Modular design and support customized testing and sorting solution.